Информационные системы управления производственной компанией
The methodology and software tools for multi-level thermal and electro-thermal design of electronic components is presented. The discussion covers 2D/3D constructions of: 1) discrete and integrated semiconductor devices; 2) monolithic and hybrid ICs; 3) MCMs and PCBs. The actual test validation through thermal measurement is demonstrated for all types of components.
I give the explicit formula for the (set-theoretical) system of Resultants of m+1 homogeneous polynomials in n+1 variables
One of the most important indicators of company's success is the increase of its value. The article investigates traditional methods of company's value assessment and the evidence that the application of these methods is incorrect in the new stage of economy. So it is necessary to create a new method of valuation based on the new main sources of company's success that is its intellectual capital.