Proceedings of 27-th IEEE Semiconductor Thermal Measurement and Management Symposium, San Jose, USA, March 2011
The 2011 Semiconductor Thermal Measurement and Management (SEMI-THERM) Symposium is an annual international forum for the presentation of new developments in and applications relating to generation and removal of heat within semiconductor devices and measurement of junction temperatures under various applications and environmental conditions. The forum of this Symposium this year couples nine sections of selected technical papers. The Symposium is preceded with four Short Courses: “Thermal Challenges in 3D Packaging”, “Transient Tth-JC Measurement and Compact Thermal Model Generation”, “Thermal Reliability Issues in Modern Electronics Systems”, “Thermal Management of Electronics”. In addition, an exhibits area offers displays of equipment, software and other resources within the thermal measurements field.
The computational model of the temperature sensors integrated on the IC chip with power transistors is developed. The 2D/3D problem of sensor placement is mathematically described by the classic heat transfer equation coupled with the equation for current density distribution. It is shown that parasitic effects of sensor current displacement and thermo-emf generation resulting from a temperature gradients (Seebeck effect) must be taken into account. For this purpose the special differential equation is introduced. The examples of point- and strip-like temperature sensors modeling for power BJTs and ICs are demonstrated.